OCP 2026 Keynote Replay: Building the Next Era of AI Infrastructure
Watch as AMD CEO and Chair Lisa Su highlights the company’s portfolio of open, full-stack compute to help support agentic AI at every scale.
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Watch as AMD CEO and Chair Lisa Su highlights the company’s portfolio of open, full-stack compute to help support agentic AI at every scale.
At the OCP keynote, AMD’s leader outlines how a broad AI portfolio will help build the next era of AI infrastructure.
Watch behind-the-scenes accounts of what it takes to engineer every detail of the AMD Helios rackscale solution.
The biggest risk is not choosing the wrong technology today. It is building infrastructure that cannot adapt tomorrow.
New AI infrastructure combines leadership compute, networking and open software, delivering rack-scale performance for at-scale AI.
AMD launches broad high-performance computing and physical AI portfolios, including its first rack-scale AI solution and the world’s most powerful AI rack, AMD Helios.
Watch as AMD leaders and AI ecosystem partners, customers and developers detail the company’s next wave of silicon, systems and software for the agentic AI era.
To meet the growing demand for AI infrastructure, investments across the Taiwan ecosystem will help expand strategic partnerships and scale advanced packaging manufacturing.
AMD and Celestica announce a collaboration to bring the open standards-based Helios rack-scale AI platform to market.
The agreement expands on the companies’ existing strategic partnership and aligns roadmaps across silicon, systems and software to deliver AI platforms purpose-built for Meta’s workloads.
AMD and TCS will help enterprise customers accelerate AI at scale with an AI training and inference platform designed to improve operational efficiency, time-to-deployment and real-world impact.
In the opening keynote, Dr. Lisa Su, AMD CEO and chair, details how the company’s AI products and deep cross-industry collaborations turn the promise of AI into real-world impact.
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