Advancing AI 2026: Partner Quotes

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AMI – Sanjoy Maity, Chief Executive Officer

“AMI is proud to collaborate with AMD to deliver a fully validated, production-ready firmware and rack management stack for the Helios platform. Built on Helios’ open architecture, this solution gives customers the flexibility to integrate, scale, and innovate while reducing deployment complexity and improving operational resilience. By tightly aligning Aptio V, MegaRAC OneTree, and rack-scale management, we are enabling faster, more predictable rollout of AI infrastructure at scale.” 


Aerospike – Srini Srinivasan, Founder and CTO

“Agentic AI dramatically increases the number of operations, orchestrating dozens of real-time data lookups and model inferences before deciding in milliseconds whether to correctly approve, decline, or flag a transaction. The combination of Aerospike and Google C4D powered by AMD EPYC ensures that fraud detection and other AI applications relying on real-time data stay fast, every time, and for every user, even when a single interaction involves many operations and a fixed deadline.”


Aligned – Chris Ensey, CEO

“We know communities are asking hard, fair questions about what data centers mean for their electric bills and their grid, and they deserve real answers — not just construction announcements. That's exactly why we chose AMD Helios. It's a platform engineered for power and cooling efficiency at the rack level, and we intend to build and operate this facility as a responsible neighbor, not just a tenant on the grid.”


ARBOR Technology – Vincent Liao, Vice President, Embedded Computing Product Division

“With the COMX-C710, ARBOR brings AI on Modules to the next level. Powered by AMD Ryzen™ AI Embedded X100 series, the module delivers a highly integrated heterogeneous computing platform that simplifies system design while enabling high-performance, real-time AI processing for robotics, medical, and industrial automation applications.”


ASRock Rack – Weishi Sa, President

“Enterprises are laying the foundation for the next generation of agentic AI, where infrastructure must deliver unprecedented levels of compute density, memory bandwidth, and efficiency to support increasingly intelligent and autonomous workloads. With 6th Gen AMD EPYC™ Server CPUs powering our next-generation server platforms, we are helping customers build resilient, scalable infrastructure that is ready for the evolving demands of AI, cloud, and enterprise computing. Together with AMD, we are enabling organizations to accelerate AI adoption with the performance and efficiency needed to shape the future of intelligent computing.”


ASUS – Paul Ju, Senior Vice President, Infrastructure Solution Business Group

“The new ASUS EPYC 9006 server series delivers exceptional performance for every enterprise workload. This launch marks a significant milestone for ASUS and our customers, providing a resilient foundation to not only boost computing efficiency but to fundamentally accelerate AI innovation, turning high-performance inference into tangible business breakthroughs.”


CASTEC International Corp. – William Lin, Director

“We are not just building machines; we are creating time for businesses and workers, allowing people to focus on more creative and higher-value work. The goal of i-Operator is to combine AMRs, collaborative robots, and edge AI to automate tasks that are repetitive, precision-critical, or potentially hazardous. By taking over material handling, loading and unloading, and inspection tasks, automation enables companies to redirect manpower towards higher-value tasks such as equipment management, process optimization, and R&D while improving operational consistency and efficiency.”


Cirrascale Cloud Services – Alex Nataros, Chief Technology Officer

“Our customers are building at a scale where infrastructure choices carry real weight, and they want to match the accelerator to the workload instead of being locked into one path. The AMD Helios rackscale solution fits how we think about the cloud: open, standards-based, and built to run the most demanding inference and training jobs without forcing customers into a closed system.”


congatec – Florian Drittenthaler, Product Line Manager

“Computer-on-Modules based on the new AMD Ryzen AI Embedded X100 Series processors deliver an unprecedented level of AI, graphics, and compute performance to the edge. Using just one high-performance COM-HPC Client Size C Computer-on-Module OEMs can now address Physical-AI applications that previously required discrete AI accelerator cards. This enables long-term available, modular embedded designs with fewer components, reduced system complexity, lower power consumption, and increased mechanical robustness. Supporting the industrial temperature range from -40 °C to +85 °C makes our modules especially beneficial for physical AI workloads in robotics, machine vision, and other rugged edge environments where reliability, size, weight, and power are critical.”


CORSAIR – Roland Oberdorfer, Chief Technology Officer

“AMD Advancing AI brings together the people building the future of AI, and it's the ideal stage to show what CORSAIR PRO and AMD can do together.”


Dell Technologies – David Schmidt, Vice President, Compute

“Our latest generation of Dell PowerEdge servers with 6th Gen AMD EPYC Server CPUs deliver dramatically more compute in the footprint enterprises already have, scaling from air-cooled to liquid-cooled rack-scale. Together, we are delivering the performance and integration that turn infrastructure investment into real business returns.”


Digital Twin Consortium – Dan Isaacs, General Manager and Chief Technology Officer

“Physical AI is where the digital twin proves its value — a robot that perceives, reasons, and acts in the real world is only as capable as the twin it trains and validates against, and that capability depends on interoperability between the two. Joining the AMD Robotics Partner Network offers the opportunity to help shape the frameworks that connect physical AI and digital twins contributing to the broader community.”


DriveNets – Ido Susan, Co-Founder and CEO

“AI infrastructure is moving from single-vendor stacks to open, multi-vendor systems, and the network makes that shift work. This reference architecture with AMD turns that into a validated blueprint: AMD Instinct GPUs and our AI fabric deliver higher throughput and lower time to first token than publicly available results — with the resiliency and consistency that production AI clusters require. This gives customers building on AMD Instinct a validated, end-to-end blueprint to maximize GPU utilization and lower cost-per-token, on open Ethernet.”


Embedded LLM – Ghee Leng Ooi, CEO

“The next AI cloud product is not a GPU hour. It is a governed agent service. TokenVisor Spaces turns AMD-powered infrastructure into a place where agents can actually work: execute tools, persist state, follow policy, leave traces, and connect back to high-performance inference. Agentic AI runs where enterprise software runs, and that makes the CPU plus GPU platform the center of the next AI cloud.”


Foundation – Sankaet Pathak, Co-Founder and CEO

“A foundational problem in robotics is closing the gap between sim and real. That comes down to not just models, but determinism, latency, and processing rich sensor data in real time. With ~2.5x faster CPU inference, equal model quality and 3x faster training speed compared to NVIDIA, the AMD-powered platform gives us the performance we need to put robots to work at scale.”


Giga Computing – Daniel Hou, General Manager

“Agentic AI and other enterprise AI deployments are placing incredible demands on data centers, driving the need for novel, more powerful solutions. Our new server platforms for AMD EPYC 9006 Series processors are engineered from the ground up, from board layout to power delivery to thermal design, so customers get GIGABYTE servers that are core-dense and space optimized without sacrificing performance. Whether it's for large-scale AI clusters or edge deployments, we've designed systems leveraging 6th Gen AMD EPYC Server CPUs that are ready from day one.”


HPE – John Carter, Vice President of Mainstream Compute

“Our longstanding partnership with AMD reflects our shared commitment to delivering the chip-to-cloud security, optimized performance, and resiliency customers expect from HPE ProLiant. AMD EPYC 9006 Series Server CPUs represent the latest innovation from AMD, bringing the efficiency and flexibility organizations need to address evolving workload requirements.”


IBASE Technology – Albert Lee, President

“We are honored to join the AMD Robotics Partner Network. By participating in AMD Advancing AI 2026, IBASE engaged with AMD experts and industry leaders to explore new opportunities in robotics, industrial automation, automotive systems, and edge AI. IBASE will continue working closely with AMD to deliver reliable, high-performance computing platforms that accelerate the deployment of physical AI in real-world applications.”


IEI – Y.T. Lee, Vice President

“AMRs are no longer just automated vehicles; they are mission-critical AI nodes that require instantaneous data processing at the edge. Through this collaboration with CASTEC, IEI demonstrates how the NANO-X100 can bring AMD Ryzen™ AI Embedded X100 Series processing capabilities into semiconductor automation and AMR applications.”


Infobell IT Solutions – Ramana Bandili, CEO

“As autonomous agentic AI transforms how enterprises operate, success will depend on seamlessly connecting intelligent agents, trusted data, high-performance infrastructure and business processes at scale. With AMD, we are combining advanced AI computing with Infobell’s software engineering expertise to help organizations build, deploy and govern autonomous, goal-driven AI solutions that can reason, act and collaborate across business functions—turning the promise of agentic AI into measurable business outcomes.”


Kontron Europe GmbH – Peter Hoser, Vice President, Product Center Boards

“With Ryzen™ AI Embedded, AMD now offers a platform that precisely meets our customers’ requirements: high scalability across different price and performance tiers, state-of-the-art embedded technology, and integrated AI acceleration for the applications of tomorrow. This combination makes Ryzen AI Embedded the ideal foundation for our motherboards and their use in a wide range of demanding industrial and commercial applications.”


Lenovo – Scott Patti, Vice President, Infrastructure Solutions Group

“The next generation of AI will be defined by intelligent agents working together to solve increasingly complex business challenges that require infrastructure purpose-built for performance and efficiency. By combining the latest 6th Gen AMD EPYC™ processors with Lenovo's industry-leading Neptune™ liquid cooling, the new Lenovo ThinkSystem SC755 delivers the compute power, scalability and energy efficiency organizations need to accelerate AI and HPC workloads while preparing for the future of agentic AI.”


Liqid – Rick Hegberg, CEO

“Liqid has established itself as the leader in GPU pooling and scaling. The AMD Instinct MI350P Series gives us the ideal PCIe-based GPU to build the next generation of AI infrastructure, allowing us to deliver solutions tuned for enterprise AI inference where utilization and cost per token decide the economics.”


mimik – Fay Arjomandi, Founder and CEO

“The industry has solved intelligence. It has not solved operationalization, and the tools we use in the cloud today do not fit Agentix-Native systems. These are living systems that behave differently by nature; you cannot bolt existing tooling onto them. That is why mimOE and the tools around it are purpose-built for the Agentix era. We run on it ourselves, every day; that is how we move fast and stay flexible as we scale.”


MiTAC Computing Technology – Rick Hwang, President

“Agentic AI and next-generation enterprise workloads require infrastructure that is fast, scalable, and efficient,” said Rick Hwang, President of MiTAC Computing Technology. “By launching our latest 6th Gen EPYC Server CPUs-based platforms at AAI Day, MiTAC is offering customers the building blocks to deploy AI-ready infrastructure that balance performance with flexibility across a wide range of data center use cases.”


MSI – Danny Hsu, General Manager of Enterprise Platform Solutions

“Customers are building increasingly diverse infrastructure to support AI, cloud-native services, and enterprise applications, making workload-optimized server platforms more important than ever. Through our strong collaboration with AMD, MSI continues to broaden its portfolio powered by 6th Gen AMD EPYC™ processors—from liquid-cooled AI servers and cloud-scale multi-node platforms to enterprise systems. Together, these solutions enable customers to deploy the right infrastructure for every workload while maximizing performance, energy efficiency, and long-term scalability.”


MulticoreWare – Vish Rajalingam, Vice President and General Manager, Mobility and Transportation BU

“A Physical AI system depends on a tightly integrated loop between perception and actuation. It must operate in real time, on real hardware, and in environments that are inherently unpredictable. That makes it a hardware-software co-design challenge, not simply an AI inference problem. Building on the open-source AMD Robotics Software Suite, we work closely with OEMs to optimize the entire stack so that latency, reliability and accuracy targets are consistently achieved in production environments. That’s the integration MulticoreWare and AMD deliver together to move intelligent robotic systems from prototype to deployment.”


Nota AI – Myungsu Chae, CEO

“For physical AI to deliver real value in industrial environments, AI models must be optimized for the compute and memory constraints of the robots on which they operate. By joining the AMD Robotics Partner Network, we are expanding our on-device AI optimization technology into robotics and look forward to collaborating with fellow network partners to support the deployment of physical AI solutions across industrial environments.”


Nutanix – Tarkan Maner, President and Chief Commercial Officer

“Our partnership with AMD delivers a scalable, production-ready AI infrastructure rooted in openness and flexibility. As enterprises transition from AI pilots to full production, they require a secure, multitenant foundation that can address data center power and cost constraints. Together, we deliver an integrated, full-stack platform optimized for hyperscale AI performance and rack-scale AI deployments, enabling high-throughput inference and agentic applications. This gives organizations and neoclouds the structural autonomy to scale their AI factories efficiently.”


Oracle Cloud Infrastructure – Karan Batta, Senior Vice President

“Oracle Cloud Infrastructure (OCI) continues to see strong momentum from its strategic collaboration with AMD as customers look for open, scalable, and high-performance infrastructure to support the next generation of AI. OCI is among the first cloud providers to adopt AMD’s open rack-scale AI infrastructure with AMD Instinct MI355X GPUs, AMD EPYC processors, and AMD Pensando networking, and we are extending that collaboration through future AMD Instinct MI450 Series, AMD EPYC 6th Generation Vencie CPUs, and Helios-based systems. Together, OCI and AMD are giving customers the performance, flexibility, and scale they need to build, train, fine-tune, and run increasingly complex AI models in production. We value AMD’s continued innovation across GPUs, CPUs, networking, and open software, and we remain deeply engaged across multiple AMD product generations as we help customers accelerate AI adoption at cloud scale.”


Pegatron – Gary Cheng, President and CEO

“As AI deployments continue to scale, customers need more than high-performance processors—they need a complete infrastructure strategy. By combining the latest 6th Gen AMD EPYC™ Server processors, AMD Pensando™ Pollara AI NIC, and AMD Instinct™ GPUs with Pegatron's expertise in system design, rack integration, and advanced cooling, we help customers accelerate AI deployment with infrastructure optimized for performance, scalability, and long-term operational efficiency.”


QCT – Mike Yang, President

“The launch of the 6th Gen AMD EPYC™ processors represents a significant milestone for the AI industry. AMD is delivering a compelling combination of leadership compute performance, open software, scalable system architecture, and exceptional energy efficiency that helps organizations accelerate AI adoption from training and inference to a broad range of workloads that support AI-driven businesses. AMD's continued innovation is helping customers build the foundation for the next generation of AI and HPC infrastructure.”


SAPPHIRE – Paul Smith, Senior Director, Embedded Solutions

“With EDGE+ Apex, our goal was to hand robotics builders a complete, production-ready foundation so they can focus on their application, not their hardware. By building on AMD Ryzen™ AI Embedded X100 Series processors and combining them with a robotics carrier board engineered for real-world sensing, connectivity and control, EDGE+ Apex helps customers move from prototype to production faster while scaling physical AI across the most demanding always-on environments.”


Schneider Electric – Manish Kumar, Executive Vice President, Secure Power and Data Centers

“Today organizations require comprehensive, AI-ready reference designs that can take them from planning to deployment faster and with less risk. Through our collaboration with AMD, we're delivering an engineering-backed reference design that bridges the gap between advanced AI compute platforms, energy tech, and real-world data center implementation, enabling customers to deploy scalable, high-density AI environments with greater confidence, efficiency, and speed.”


Supermicro – Charles Liang, President and CEO

“Agentic AI requires a new generation of infrastructure optimized for performance, scalability, and efficiency. Our H15 portfolio, built on Supermicro's DCBBS architecture, combines industry-leading performance with flexible, rack-scale deployment. Our continued market success is supported by a comprehensive global services team, a resilient U.S. supply chain, and continued investment in helping customers deploy and scale AI with confidence.”


Synopsys – Shankar Krishnamoorthy, Chief Product Development Officer

“In this era of unprecedented AI infrastructure buildout, engineering teams need solutions enabling extreme co-design to accelerate innovation cycles and deliver leading-edge performance with first-time right silicon. From architecture through silicon bring-up, we are proud to have collaborated with AMD across emulation, verification, multi-die, multiphysics, and AI-powered solutions to deliver their bold MI455X design. It is a demonstration of how integrated, cross-domain development workflows and intelligent automation can transform ambitious architectures into production-ready AI platforms in record time.”


TensorMesh – Junchen Jiang, CEO and LMCache Co-Creator

“This powerful new collaboration builds on AMD’s recent strategic investment in Tensormesh and expands the capabilities of AMD GPUs. Together, we’re greatly enhancing the memory that inference engines can access for model weights and KV cache, using all of the memory resources on each node.”


TensorWave – Jeff Tatarchuk, Chief Growth Officer and Co-Founder

“At TensorWave, we believe the future of AI starts with better infrastructure. AMD Helios brings compute, memory, and networking together at rack scale, enabling our customers to build AI faster, more efficiently, and with better economics at scale.”


VAST Data – John Mao, Vice President, Global Technology Alliances

“AI is entering an operational phase where infrastructure efficiency matters as much as model performance. The industry is discovering that inference is fundamentally a data problem. Success depends on how effectively organizations can bring data, compute, memory and intelligence together as a single system. The VAST AI Operating System was built for this transition, giving AI cloud providers and enterprises a more efficient, scalable and open foundation for training, inference and the next generation of agentic AI applications.”


Vultr – J.J. Kardwell, CEO

“Enterprises and AI innovators are training and deploying increasingly complex AI models, and AMD Instinct MI455X GPUs, paired with the Helios rackscale architecture is optimized for those workloads. By combining substantial memory capacity with high-performance interconnects, this architecture helps our customers move efficiently from training into production inference. Deploying this architecture across Vultr's global footprint provides access to high-performance AI infrastructure wherever customers are building and accelerates turning ambitious AI plans into production reality.”

TopicsArtificial IntelligenceData CenterEmbeddedSoftware #2026-aai
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