AMD Launches Ryzen 9 9950X3D2 Dual Edition Processor, the First Dual Processor with AMD 3D V-Cache Technology

CAUTIONARY STATEMENT 

This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of the AMD Ryzen™ 9 9950X3D2 processor, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and are generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: impact of government actions and regulations such as export regulations, import tariffs, trade protection measures, and licensing requirements; competitive markets in which AMD’s products are sold; the cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; AMD’s ability to introduce products on a timely basis with expected features and performance levels; loss of a significant customer; economic and market uncertainty; quarterly and seasonal sales patterns; AMD's ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, substrates or manufacturing processes; ability to achieve expected manufacturing yields for AMD’s products; AMD's ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential security incidents including IT outages, data loss, data breaches and cyberattacks; uncertainties involving the ordering and shipment of AMD’s products; AMD’s reliance on third-party intellectual property to design and introduce new products; AMD's reliance on third-party companies for design, manufacture and supply of motherboards, software, memory and other computer platform components; AMD's reliance on Microsoft and other software vendors' support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; failure to maintain an efficient supply change as customer demand changes; AMD's ability to rely on third party supply-chain logistics functions; AMD’s ability to effectively control sales of its products on the gray market; impact of climate change on AMD’s business; AMD’s ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; impact of environmental laws, conflict minerals related provisions and other laws or regulations; evolving expectations from governments, investors, customers and other stakeholders regarding corporate responsibility matters; issues related to the responsible use of AI; restrictions imposed by agreements governing AMD’s notes, the guarantees of Xilinx’s notes and the revolving credit agreement; AMD’s ability to satisfy financial obligations under guarantees and other commercial commitments; impact of acquisitions, joint ventures and/or investments on AMD’s business and AMD’s ability to integrate acquired businesses; impact of any impairment of the combined company’s assets; political, legal and economic risks and natural disasters; future impairments of technology license purchases; AMD’s ability to attract and retain key employees; and AMD’s stock price volatility. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s most recent reports on Forms 10-K and 10-Q.

1. Boost Clock Frequency is the maximum frequency achievable on the CPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads. GD-150.

2. Testing done by AMD performance labs as of February 2026, on a test system configured with Ryzen™ 9 9950X3D2 CPU, 16 core, 32 GB DDR5-6000 Memory, Windows 11 Pro, X870E Motherboard, Nvidia GeForce RTX 5090 (GeForce 591.86), compared against a similarly configured system with Ryzen™ 9 9950X3D CPU comparing performance (Best Performance) in the following render applications: Unreal Engine Compilation: Uninitialized Shader Cache, Unreal Engine Compilation: Initialized Shader Cache, Chromium Compilation. System manufacturers may vary configurations, yielding different results. GNR-69.

3. Testing done by BOXX performance labs as of February 2026, on a test system configured with Ryzen™ 9 9950X3D2 CPU, 16 core, 32 GB DDR5-6000 Memory, Windows 11 Pro, X870E Motherboard, Nvidia GeForce RTX 5090 (GeForce 591.86), compared against a similarly configured system with Ryzen™ 9 9950X3D CPU;  comparing performance (Best Performance) in the following applications:  ComfyUI, Matlab, SPEC Workstation 4.0 Data Science, SPEC Workstation 4.0 LAMMPS, SPEC Workstation 4.0 ONNX Inference, SPEC Workstation 4.0 OpenFOAM, SPEC Workstation 4.0 Python 3, SPEC Workstation 4.0 MFEM, SPEC Workstation 4.0 NAMD, SPEC Workstation 4.0 Convolution, SPEC Workstation 4.0 Rodinia CFD, SPEC Workstation 4.0 Rodinia Life Sciences. System manufacturers may vary configurations, yielding different results. GNR-70.

4. Testing done by BOXX performance labs as of February 2026, on a test system configured with Ryzen™ 9 9950X3D2 CPU, 16 core, 32 GB DDR5-6000 Memory, Windows 11 Pro, X870E Motherboard, Nvidia GeForce RTX 5090 (GeForce 591.86), compared against a similarly configured system with Ryzen™ 9 9950X3D CPU; comparing performance (Best Performance) in the following rendering applications: V-RAY Benchmark 6.00.02, Keyshot Viewer 2025.3, Revit Render 2026.4, Corona Render Benchmark 10, Twinmotion 2025.2 White Studio, Blender 4.5, Autodesk Maya. System manufacturers may vary configurations, yielding different results. GNR-72.

5. Testing done by BOXX performance labs as of February 2026, on a test system configured with Ryzen™ 9 9950X3D2 CPU, 16 core, 32 GB DDR5-6000 Memory, Windows 11 Pro, X870E Motherboard, Nvidia GeForce RTX 5090 (GeForce 591.86), compared against a similarly configured system with Ryzen™ 9 9950X3D CPU; comparing performance (Best Performance) in the following content creation applications: Puget Bench for Creators After Effects 25.5, Puget Bench for Creators Davinci Resolve, Geekbench 6.5.0 Single Core Score, Geekbench 6.5.0 Multi Core Score, Blackmagic RAW Speed Test 5.1  BRAW 12:1 HD CPU, Blackmagic RAW Speed Test 5.1  BRAW 12:1 4K CPU, Blackmagic RAW Speed Test 5.1  BRAW 12:1 6K CPU, Blackmagic RAW Speed Test 5.1  BRAW 12:1 8k CPU. System manufacturers may vary configurations, yielding different results. GNR-73.